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Markeeringud

Iga firma kasutab oma komponentide tähistamisel tüübitähistust, mis sisaldab kodeeritud andmeid tüübi,nimisuuruse, tolerantsi, võimsuse, pinge  jm kohta. Tootmise seisukohast peab antud info väljenduma toote komponentide nimekirjas. Oht on eksida esmalt toote loonud inseneril ja ostuosakonnal. Näiteks võib mõne numbri või tähe eiramine tuua tootmise seisukohalt suuri tagasilööke. Juhul, kui viimane täht koodis näitab, kas aukmontaaøi komponendid on lindil või lahtiselt. Lahtiste komponentide saabumisel jääb tootmine seisma, sest puudub võimalus neid masinaga ladumiseks ette valmistada.
Samas on lahtised komponendid väga teretulnud insenerile, kes valmistab esimest prototüüpi.

SMD komponente on erinevate korpuse mõõtmete ja kujuga.

Pindliite komponendid on harilikult väiksemad, kui nende "jalgadega" analoogid.

Pindliite komponendid on disainitud käsitlemiseks masinatega. Elektroonikatööstus on standardiseerinud komponentide korpuste kujud ja mõõtmed. Kõige levinum korpuste standardisüsteem on JEDEC. 

Hästi on ära toodud SMD komponentide markeerimisüsteem, ning selgitused sellele alljärgneval web aadressil   http://www.marsport.org.uk/smd/mainframe.htm

SMD komponentide markeering

SMD komponentide markeering on numbriline sarnaselt värvikoodi markeerimispõhimõttele.

Esimesed 2 (või 3) numbrit on takistuse väärtus Ohm`ides ja 3-s (4-s) number näitamaks NULLIDE arvu numbri järel (10 aste)

Takistitel alla 10 Ohm`ise väärtusega kasutatakse R tähte tähistamaks koma asukohta. Allpool mõned näited:

 Kolme numbriga näited                                          Nelja numbriga näited

330 tähistab   33 ohmi - mitte 330 ohmi         1000 tähistab 100 ohmi          - mitte 1000 ohmi
221 tähistab 220 ohmi                                     4992 tähistab   49 900 ohmi, või   49.9 kohmi
683 tähistab 68 000 ohmi, või 68 kohmi        16234 tähistab 162 000 ohmi, või 162    kohmi
105 tähistab 1 000 000 ohms, või 1 Mohm     0R56 tähistab       R56 ehk              0.56 ohmi
8R2 tähistab 8.2 ohmi  
 
NB! SMD-l    330 ei ole 330 Ohmi    ja  1000 ei ole 1000 Ohmi

Samast algallikast loeme ka teistsuguseid markeerimissüsteeme - kus kasutatakse erinevaid tähtedega koode, markeerimaks erinevaid numbreid nii nominaalväärtuse kui täpsusklass suhtes.

Üks on kindel -

soovitus ALATI KOMPONENDI VÄÄRTUS TESTRIGA (Ohm-meetriga) üle mõõta

 

SMD keraamiliste kondensaatorite markeering

SMD keraamiliste kondensaatorite markeerimisel kasutatakse koode, mis koosnevad tähtedest (1-2 tähte) ja numbritest.
ESIMENE TÄHT on harilikult tootja tehase kood.
TEINE TÄHT tähistab 10 astet pF väärtusele (0-de arvu pF järel)
Näiteks

„S3“ on 4,7 nF (4,7 x 1000 pF)
„KA4“ on 100 pF (1,0 x 100 pF)

Täht Mantissa    Täht Mantissa    Täht  Mantissa     Täht Mantissa
A         1.0             J       2.2             S        4.7              a       2.5
B         1.1             K       2.4             T        5.1              b       3.5
C         1.2             L       2.7             U        5.6              d       4.0
D         1.3             M      3.0             V         6.2             e       4.5
E          1.5             N      3.3             W        6.8             f        5.0
F          1.6             P       3.6             X        7.5             m       6.0
G          1.8            Q       3.9             Y         8.2             n       7.0
H           2.0           R        4.3            Z          9.1             t        8.0
                                                                                       y        9.0 

SMD elektrolüütkondensaatorite markeering

SMD  elektrolüütkondensaatoritel märgitakse tavaliselt nende mahtuvus ja tööpinge komponendi korpusele.
Mõnikord on kasutusel TÄHEST ja 3-st NUMBRIST kood.

TÄHT tähistab tööpinget
3 numbrit – 2 esimest arvuline väärtus ja 3-s nullide arvu pF-l

Näiteks „A475“ on 4,7 mikroF (4,7 x 100000 pF), 10 Volti tööpingele

Ring või triip tähistab „+“ klemmi.

Täht   Pinge
e        2.5
G       4
J        6.3
A     10
C     16
D     20
E     25
V     35
H     50

 

 

 

Koodid on antud allpool meetermõõdustiku järgi ja ka tollmõõdustiku jaoks. Pikkus ja laius komponendil millimeetrites ja tollides - näiteks meetersüsteemis 2520 tähendab, et komponendi pikkus on 2,5 mm ja laius 2,0 mm, mis vastaks tollmõõdustikus 0,10 tolli x 0,08 tolli (vastav kood oleks 1008).

2 otsaga SMD komponendid

Näiteks Fotol LED SMD komponent mõõtmetega 1.6 mm x 0.8 mm x 0.4 mm.

Foto allikas: http://eu.mouser.com/Search/include/LargeProductImage.aspx?path=liteon/lrg/ltw.jpg&mfrName=Lite-On&mfrPartNum=LTW-C193TS5

Pakendatakse harilikult lindil, rullis 3000 tk, kusjuures 1 komponendi hind kogu rulli tellimisel ca 0,1 EURi, tootja: Lite-On, kuid on ka palju teisi tootjaid. 

Toote spetsifikatsioonist võime lugeda, et trükkplaadil on jooteplatside suurused ettenähtud mõõtudes 0,8 x 0,8 mm.

Käsijootmisel võib kasutada temperatuuri kuni 300°C Max. Jootmiskestvus 3 sec. Max. ja ainult ühekordse puudutusega.

Samas spetsifikatsioonis on ära toodud ka jootetingimused lainejootmisele (näit. max 10 sek. 240 kraadi C juures) ja ka Reflow ahju kasutamisel.

Korpusel roheline märk tähistab katoodi (miinuskontakti) tootel.

http://www.mouser.com/ds/2/239/Lite-On-LTW-C193TS5-190113.pdf

 

Ristkülikukujulised passiivkomponendid (harilikult takistid ja kondensaatorid):

Näidatud lubatavad võimsused on takistite jaoks arvestuslik suurus.
01005 (0402 metric): 0.4 mm × 0.2 mm (0.016 in × 0.0079 in). Lubatav max võimsus = 0.031 watti
0201 (0603 metric): 0.6 mm × 0.3 mm (0.024 in × 0.012 in).     Lubatav max võimsus = 0.05 watti
0402 (1005 metric): 1.0 mm × 0.5 mm (0.039 in × 0.020 in). Lubatav max.võimsus = 0.1 või 0.062 watti
0603 (1608 metric): 1.6 mm × 0.8 mm (0.063 in × 0.031 in).   Lubatav max võimsus = 0.1 watti
0805 (2012 metric): 2.0 mm × 1.25 mm (0.079 in × 0.049 in). Lubatav max võimsus = 0.125 watti

1206 (3216 metric): 3.2 mm × 1.6 mm (0.13 in × 0.063 in). Lubatav max võimsus = 0.25 watti
1210 (3225 metric): 3.2 mm × 2.5 mm (0.13 in × 0.098 in). Lubatav max võimsus = 0.5 watti
1806 (4516 metric): 4.5 mm × 1.6 mm (0.18 in × 0.063 in)
1812 (4532 metric): 4.5 mm × 3.2 mm (0.18 in × 0.13 in).   Lubatav max võimsus = 0.75 watti
2010 (5025 metric): 5.0 mm × 2.5 mm (0.20 in × 0.098 in). Lubatav max võimsus = 0.75 watti
2512 (6332 metric): 6.4 mm × 3.2 mm (0.25 in × 0.13 in).   Lubatava max võimsus = 1 watti
2920: 7.4 mm × 5.1 mm (0.29 in × 0.20 in)


SMD kondensaatorid

Tantalum kondensaatoritel pikkus (tüüp.) x laius (tüüp.) x kõrgus (max.)
EIA 2012-12 (Kemet R, AVX R): 2.0 mm × 1.3 mm × 1.2 mm
EIA 3216-10 (Kemet I, AVX K): 3.2 mm × 1.6 mm × 1.0 mm
EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm
EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
EIA 3528-12 (Kemet T, AVX T): 3.5 mm × 2.8 mm × 1.2 mm
EIA 3528-21 (Kemet B, AVX B): 3.5 mm × 2.8 mm × 2.1 mm
EIA 6032-15 (Kemet U, AVX W): 6.0 mm × 3.2 mm × 1.5 mm
EIA 6032-28 (Kemet C, AVX C): 6.0 mm × 3.2 mm × 2.8 mm
EIA 7260-38 (Kemet E, AVX V): 7.3 mm × 6.0 mm × 3.8 mm
EIA 7343-20 (Kemet V, AVX Y): 7.3 mm × 4.3 mm × 2.0 mm
EIA 7343-31 (Kemet D, AVX D): 7.3 mm × 4.3 mm × 3.1 mm
EIA 7343-43 (Kemet X, AVX E): 7.3 mm × 4.3 mm × 4.3 mm

Aluminium kondensaatorid
(Panasonic / CDE A, Chemi-Con B): 3.3 mm × 3.3 mm
(Panasonic B, Chemi-Con D): 4.3 mm × 4.3 mm
(Panasonic C, Chemi-Con E): 5.3 mm × 5.3 mm
(Panasonic D, Chemi-Con F): 6.6 mm × 6.6 mm
(Panasonic E/F, Chemi-Con H): 8.3 mm × 8.3 mm
(Panasonic G, Chemi-Con J): 10.3 mm × 10.3 mm
(Chemi-Con K): 13.0 mm × 13.0 mm
(Panasonic H): 13.5 mm × 13.5 mm
(Panasonic J, Chemi-Con L): 17.0 mm × 17.0 mm
(Panasonic K, Chemi-Con M): 19.0 mm × 19.0 mm

SOD: Small Outline Diode - Väikesed dioodid

number lühendi SOD järgi ilmestab komponendi suurust
SOD-723: 1.4 × 0.6 × 0.59 mm
SOD-523: 1.25 × 0.85 × 0.65 mm
SOD-323 (SC-90): 1.7 × 1.25 × 0.95 mm
SOD-128: 5 × 2.7 × 1.1 mm
SOD-123: 3.68 × 1.17 × 1.60 mm
SOD-80C: 3.50 × 1.50 × Lisa info

MELF (Metal Electrode Leadless Face): põhiliselt takistid ja dioodid;

barrel shaped components, dimensions do not match those of rectangular references for identical codes.
MicroMelf (MMU) Suurus 0102: pikkus: 2.2 mm, diam.: 1.1 mm. Takistitel = 0.2 - 0.3 watt / 150 V
MiniMelf (MMA) Suurus 0204: pikkus: 3.6 mm, diam.: :1.4 mm. Takistitel = 0.25 - 0.4 watt / 200 V
Melf (MMB) Srus 0207: pikkus: 5.8 mm, diam.: 2.2 mm. Takistitel = 0.4 - 1 watt / 300 V

Kolme väljaviiguga korpused

SOT: Small Outline Transistor,


SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad
SOT-89: 4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad
SOT-23 (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor
SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals
SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals
SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals
SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead
SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless

DPAK (TO-252): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
D2PAK (TO-263): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
D3PAK (TO-268): even larger than D2PAK
Five- and six-terminal packages
SOT: small-outline transistor, with more than three terminals


SOT-23-5 (SOT-25): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals
SOT-23-6 (SOT-26): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals
SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals
SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals
SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals
SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals
SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals


Erinevaid SMD komponente (chips, desoldered)


MLP package 28-pin chip, upside down to show contacts


32-pin MQFP chip with manually soldered wires attached for prototyping. The same effect can be achieved using commercially available breakout boards

Packendid rohkem kui 6 terminaliga
Dual-in-line
flatpack was one of the earliest surface-mounted packages.
SOIC: (Small-Outline Integrated Circuit), dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm

SOJ: Small-Outline Package, J-Leaded, the same as SOIC except J-leaded [44]
TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
SSOP: Shrink Small-Outline Package, pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm
TSSOP: Thin Shrink Small-Outline package.
QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
DFN: Dual Flat No-lead, smaller footprint than leaded equivalent
Quad-in-line
PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
QFP: Quad Flat Package, various sizes, with pins on all four sides
LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
CQFP: Ceramic Quad Flat-Pack, similar to PQFP
MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
TQFP: Thin Quad Flat Pack, a thinner version of PQFP
QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
MLP (MLF): Micro Leadframe Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN) [45]
PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking
Grid arrays
PGA: Pin grid array.
BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
FBGA: Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
LFBGA: Low profile Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
TFBGA: Thin Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
CCGA: Ceramic Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
?BGA: micro-BGA, with ball spacing less than 1 mm
LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
Non-packaged devices (although surface-mount, these devices require specific process for assembly):
COB: Chip-On-Board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
COF: Chip-On-Flex; a variation of COB, where a chip is mounted directly to a flex circuit.
COG: Chip-On-Glass; a variation of COB, where a chip, typically a Liquid crystal display (LCD) controller, is mounted directly on glass:.
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.[citation needed]

Identification

Takistid
SMD resistors usually are marked with their resistance values using three digits, two significant digits and a multiplier digit. These are quite often white lettering on a black background, but other coloured backgrounds and lettering can be used.

The black or coloured coating is usually only on one face of the device, the sides and other face simply being the uncoated, usually white ceramic substrate. The coated surface, with the resistive element beneath is normally positioned face up when the device is soldered to the board although they can rarely be seen mounted with the uncoated underside face up, whereby the resistance value code is not visible.

For 1% precision SMD resistors, the EIA-96 code is used, as three digits would otherwise not convey enough information. This code consists of two digits and a letter: the digits denote the value's position in the E96 sequence, while the letter indicates the multiplier.

Typical examples of resistance codes
102 = 10 00 = 1000 ? = 1 k?
0R2 = 0.2 ?
684 = 68 0000 = 680 000 ? = 680 k?
68X = 499 × 0.1 = 49.9?
There is an online tool to translate codes to resistance values on the Hobby-Hour website.

Kondensaatorid
Non electrolytic capacitors are usually unmarked and the only reliable method of determining their value is removal from the circuit and subsequent measurement with a capacitance meter or impedance bridge. The materials used to fabricate the capacitors, such as Nickel Tantalate, possess different colours and these can give an approximate idea of the capacitance of the component.

Light grey body colour indicates a capacitance which is generally less than 100pF.
Medium Grey colour indicates a capacitance anywhere from 10pF to 10nF.
Light brown colour indicates a capacitance in a range from 1nF to 100nF.
Medium brown colour indicates a capacitance in a range from 10nF to 1?F.
Dark brown colour indicates a capacitance from 100nF to 10?F.
Dark grey colour indicates a capacitance in the ?F range, generally 0.5 to 50?F, or the device may be an inductor and the dark grey is the colour of the ferrite bead. (An inductor will measure a low resistance to a multimeter on the resistance range whereas a capacitor, out of the circuit, will measure a near infinite resistance.)
Generally the larger the physical size, the larger the capacitance or voltage rating will be when all other ratings are held constant. For example, a 100nF 50v capacitor may come in the same package as a 10nF 500V device. If both appear on the same board, the two can be told apart by their usage (context). The device rated 500V will typically be designed into a high voltage or high energy circuit, whereas the 50V rated device would be found in the small signal part of the circuit.

SMD (non electrolytic) capacitors, which are usually monolithic ceramic capacitors, exhibit the same body colour on all four faces not covered by the end caps.

SMD electrolytic capacitors, usually tantalum capacitors, and film capacitors are marked like resistors, with two significant figures and a multiplier in units of pico Farads or pF, (10?12 Farad.)

Näiteid
104 = 100nF = 100 000pF
226 = 22?F = 22 000 000pF
The electrolytic capacitors are usually encapsulated in black or beige epoxy resin with flat metal connecting strips bent underneath. Some film or tantalum electrolytic types are unmarked and possess red, orange or blue body colours with complete end caps, not metal strips.

Inductors
Due to the small dimensions of SMDs, SMT inductors are limited to values of less than about 1mH. Smaller inductances with moderately high current ratings are usually of the ferrite bead type. They are simply a metal conductor looped through a ferrite bead and almost the same as their through-hole versions but possess SMD end caps rather than leads. They appear dark grey and are magnetic, unlike capacitors with a similar dark grey appearance. These ferrite bead type are limited to small values in the nH (nano Henry), range and are often used as power supply rail decouplers or in high frequency parts of a circuit. Larger inductors and transformers may of course be through-hole mounted on the same board.

SMT inductors with larger inductance values often have turns of wire or flat strap around the body or embedded in clear epoxy, allowing the wire or strap to be seen. Sometimes a ferrite core is present also. These higher inductance types are often limited to small current ratings, although some of the flat strap types can handle a few amps.

As with capacitors, component values and identifiers are not usually marked on the component itself; if not documented or printed on the PCB, measurement, usually removed from the circuit, is the only way of determining them.

Discrete semiconductors
Discrete semiconductors, such as transistors, diodes and F.E.T.s are often marked with a cryptic two- or three-symbol code in which the same code marked on different packages or on devices made by different manufacturers can translate to different devices.

Many of these codes, used because the devices are too small to be marked with more traditional numbers used on through-hole equivalent devices, correlate to more familiar traditional part numbers when a correlation list is consulted.

GM4PMK in the United Kingdom has prepared a correlation list, and a similar .pdf list is also available, although these lists are not complete.

Integrated circuits - IC  Integraalskeemid
Generally, integrated circuit packages are large enough to be imprinted with the complete part number which includes the manufacturer's specific prefix, or a significant segment of the part number and the manufacturer's name or logo.

Näiteid tootjatele spetsiifiliste markeeringutega:
Philips HEF4066 või Motorola MC14066. (a 4066 Quad Analog Switch.)
Fujitsu Electric FA5502. (a 5502M Boost Architecture Power factor correction controller.)

 

 

 

 

 

 

 


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